TP-3: Premium Performance Thermal Pad, 200 x 100 x 1.0 mm (2 Pack) PLEASE NOTE: Due to the extremely low hardness of thermally conductive pads, a more demanding installation is to be expected. Please refer to the User Manual MINIMIZATION OF THERMAL RESISTANCE: The thinner the pad, the lower the thermal resistance. Thanks to its good compression properties, the very soft heat conduction pad is particularly a good heat conductor HIGH PERFORMANCE: Based on silicone and a special filler, TP-3 also outperforms high-performance pads, especially when height differences of closely spaced chips VERSATILE APPLICATIONS: Heat-conducting, vibration-damping, mouldable, electrically insulating – can be easily cut to size. Ideal for RAM, chipset, IC in PC, laptop, console, graphic cards SAFE HANDLING: The pad contains no metal particles, is electrically insulating and non-capacitive. Handling is therefore safe, as contact with electrical parts will not cause damage BRIDGING GAPS: The TP-3 are softer than conventional pads and therefore particularly suitable for different heights and possible tolerances, without stressing sensitive components TECHNICAL DATA: Quantity: Pack of 2, Size: 200 x 100 x 1.0 mm, Hardness: 55 Shore 00, Operating temperature: -40~150 ℃, Relative density: 3.4 g/cm³